GE IC698CHS217 Backplane Module, Modular, High-Speed
The GE IC698CHS217 is a high-density I/O carrier module for the RX3i PACSystems. It supports up to 16 I/O modules and offers a backplane current of 10A at 3.3V. Typical applications include complex automation in industries like manufacturing and energy management. Compared to the IC698CPE030-HN, the IC698CHS217 focuses on I/O expansion rather than CPU functions, while the IC693CPU363 is an older model with less I/O capacity and slower processing speed.
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